You signed in with another tab or window. Reload to refresh your session.You signed out in another tab or window. Reload to refresh your session.You switched accounts on another tab or window. Reload to refresh your session.Dismiss alert
{{ message }}
Instantly share code, notes, and snippets.
🦝
Dani
ellygaytor
🦝
Integrated science with astrophysics student at Western University.
This file contains bidirectional Unicode text that may be interpreted or compiled differently than what appears below. To review, open the file in an editor that reveals hidden Unicode characters.
Learn more about bidirectional Unicode characters
This file contains bidirectional Unicode text that may be interpreted or compiled differently than what appears below. To review, open the file in an editor that reveals hidden Unicode characters.
Learn more about bidirectional Unicode characters
This file contains bidirectional Unicode text that may be interpreted or compiled differently than what appears below. To review, open the file in an editor that reveals hidden Unicode characters.
Learn more about bidirectional Unicode characters
When soldering, NEVER apply solder directly to the soldering iron (except when “tinning” the tip of the iron). Solder is not applied directly from the iron to the electronics. In fact, touching the actual solder site with the soldering iron is often the worst thing you can do. This is because, irritatingly, the solder is very often more attracted to the soldering iron than the spot where you actually want the solder to go. The iron seems to have an almost magnetic attraction for the molten solder, and when this happens, touching the iron directly to the soldering point will result in nothing more than a rounded blob of solder collected on the tip of the iron, with no solder actually on the joint. Attempting to add more solder will only increase the size of the blob on the iron, until gravity finally takes over when the blob becomes so huge that its surface tension cannot keep it on the tip of the iron any longer. When this happens and the blob falls onto the solder joint, it is usually so hug
This file contains bidirectional Unicode text that may be interpreted or compiled differently than what appears below. To review, open the file in an editor that reveals hidden Unicode characters.
Learn more about bidirectional Unicode characters
This file contains bidirectional Unicode text that may be interpreted or compiled differently than what appears below. To review, open the file in an editor that reveals hidden Unicode characters.
Learn more about bidirectional Unicode characters
This file contains bidirectional Unicode text that may be interpreted or compiled differently than what appears below. To review, open the file in an editor that reveals hidden Unicode characters.
Learn more about bidirectional Unicode characters